Multilayer electronic component

ABSTRACT

A multilayer electronic component includes: a body including one or more ceramic layers or magnetic layers; an inductor part including coil portions disposed in the body to be perpendicular to a lower surface of the body; a plurality of internal electrodes disposed in the body to be perpendicular to the lower surface of the body; and an input terminal, an output terminal, and a ground terminal disposed on the lower surface of the body, wherein the body includes a capacitor part comprising at least one among the plurality of internal electrodes and at least one among the coil portions with at least one of the ceramic layers or magnetic layers interposed therebetween.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims the benefit of priority to Korean PatentApplication No. 10-2014-0151919, filed on Nov. 4, 2014 with the KoreanIntellectual Property Office, the entirety of which is incorporatedherein by reference.

BACKGROUND

The present disclosure relates to a multilayer electronic component anda board having the same.

In a time division multiple access (TDMA) phone, which uses a TDMAscheme, battery voltage may fluctuate when current is consumed duringsignal transmission.

Meanwhile, when output voltage increases, signals and noise areamplified, and a total harmonic distortion+noise (THD+N) value isdeteriorated.

In addition, in terminals that use the TDMA scheme, attenuation andnoise, which are major transmission faults, may also occur during datatransmission.

In order to solve the above-mentioned problems, terminals using the TDMAscheme may include ferrite beads or dedicated electro-magneticinterference (EMI) filters. However, further research into dedicated EMIfilters having improved broadband attenuation characteristics andexcellent noise-reduction effects is ongoing.

Meanwhile, as frequency bands of a signal and noise are close to eachother, demand for a filter capable of decreasing equivalent seriesinductance (ESL), using high frequency, and having excellentnoise-removal efficiency has increased.

RELATED ART DOCUMENT

-   (Patent Document 1) Korean Patent Laid-Open Publication No.    10-2007-0039365

SUMMARY

One aspect of the present disclosure provides a multilayer electroniccomponent and a board having the same.

According to one aspect of the present disclosure, a multilayerelectronic component comprises a body including one or more ceramic ormagnetic layers; an inductor part including coil portions disposed inthe body to be perpendicular to a lower surface of the body; a pluralityof internal electrodes disposed in the body to be perpendicular to thelower surface of the body; and an input terminal, an output terminal,and a ground terminal disposed on the lower surface of the body, whereinthe body includes a capacitor part comprising at least one among theplurality of internal electrodes and at least one among the coilportions with at least one of the ceramic or magnetic layers interposedtherebetween.

Each of the plurality of internal electrodes may have a respective leadexposed to the lower surface of the body.

The plurality of internal electrodes may form at least two internalelectrode units having different widths.

The inductor part and the capacitor part may be connected to each otherin parallel.

The coil portions may be connected to each other through vias.

According to another aspect of the present disclosure, a multilayerelectronic component comprises a body including one or more ceramiclayers or magnetic layers; an inductor part including first and secondcoil portions disposed in the body to be perpendicular to a lowersurface of the body; a capacitor part including first and secondinternal electrodes disposed in the body to be perpendicular to thelower surface of the body, the first and second internal electrodes eachhaving respective leads exposed to the lower surface of the body; and aninput terminal, an output terminal, and a ground terminal disposed onthe lower surface of the body, wherein the capacitor part includes afirst capacitor comprising the first internal electrode and the secondcoil portion and a second capacitor comprising the second internalelectrode and the second coil portion.

The first and second internal electrodes may have different widths.

The first and second coil portions may be connected to each otherthrough vias.

According to another aspect of the present disclosure, a board having amultilayer electronic component may include: a printed circuit board onwhich first to third electrode pads are provided; and the multilayerelectronic component as described above mounted on the printed circuitboard.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription taken in conjunction with the accompanying drawings.

FIG. 1 is a perspective view of a multilayer electronic component,according to a first exemplary embodiment.

FIG. 2 is an exploded perspective view of first to fourth coil portionsand first and second internal electrodes that may be used in themultilayer electronic component illustrated in FIG. 1.

FIG. 3 is a plan view of the first and second internal electrodesillustrated in FIG. 2.

FIG. 4 is an equivalent circuit diagram of the multilayer electroniccomponent illustrated in FIG. 1.

FIG. 5 is a perspective view of a board in which the multilayerelectronic component of FIG. 1 is mounted on a printed circuit board.

DETAILED DESCRIPTION

Hereinafter, embodiments of the present disclosure will be described indetail with reference to the accompanying drawings.

The disclosure may, however, be embodied in many different forms andshould not be construed as being limited to the embodiments set forthherein. Rather, these embodiments are provided so that this disclosurewill be thorough and complete, and will fully convey the scope of thedisclosure to those skilled in the art. In the drawings, the shapes anddimensions of elements may be exaggerated for clarity, and the samereference numerals will be used throughout to designate the same or likeelements.

Directions of a hexahedron will be defined in order to clearly describeexemplary embodiments in the present disclosure. L, W, and T illustratedin the accompanying drawings refer to a length direction, a widthdirection, and a thickness direction, respectively. Here, a widthdirection refers to a direction in which dielectric or magnetic layersare layered, and a thickness direction refers to a directionperpendicular to the direction in which the dielectric layers or themagnetic layers are layered.

Multilayer Electronic Component

Hereinafter, exemplary embodiments in the present disclosure will bedescribed in detail with reference to the accompanying drawings.

FIG. 1 is a perspective view of a multilayer electronic componentaccording to a first exemplary embodiment.

FIG. 2 is an exploded perspective view of first to fourth coil portionsand first and second internal electrodes that may be used in themultilayer electronic component illustrated in FIG. 1.

Referring to FIGS. 1 and 2, a multilayer electronic component 100,according to the first exemplary embodiment, may include a body 110including one or more dielectric and/or magnetic layers 111 and an inputterminal 131, an output terminal 132, and a ground terminal 133 disposedon a lower surface of the body 110.

In the present exemplary embodiment, the body 110 may have upper andlower surfaces opposing each other, and first and second end surfaces inthe length direction and first and second side surfaces in the widthdirection that connect the upper and lower surfaces to each other.

A shape of the body 110 is not particularly limited, but may behexahedral as illustrated.

The body 110 may include one or more dielectric and/or magnetic layers111, and may be formed by stacking a plurality of dielectric and/ormagnetic layers 111.

The plurality of dielectric and/or magnetic layers 111 forming the body110 may be sintered together and may be integrated with each other sothat boundaries between adjacent dielectric and/or magnetic layers 111are not readily apparent.

The dielectric layers forming the body 110 may be formed by sinteringceramic green sheets containing ceramic powder, an organic solvent, andan organic binder. The ceramic powder, which may be a high-k material,may be a barium titanate (BaTiO₃) based material, a strontium titanate(SrTiO₃) based material, or the like, but is not limited thereto.

The magnetic layers forming the body 110 may be formed of an Ni—Cu—Znbased ferrite material, an Ni—Cu—Zn—Mg based ferrite material, an Mn—Znbased ferrite material, or an Fe—Si—B—Cr based amorphous metal powdermaterial, which is a metal-based soft magnetic material. However, amaterial of the magnetic layers is not limited thereto.

One or more dielectric and/or magnetic layers 111 may form the body 110.That is, the body 110 may be formed using the dielectric and/or magneticlayers 111, alone or in combination.

For example, in a case in which the body 110 includes the magneticlayers 111, an inductor part may have the form of a ferrite bead to bedescribed below.

According to the first exemplary embodiment, the input terminal 131, theoutput terminal 132, and the ground terminal 133 may be disposed on thelower surface of the body 110.

The multilayer electronic component 100, according to the firstexemplary embodiment, may be a dedicated electromagnetic interference(EMI) filter which may improve noise removal efficiency, and excellentnoise reduction may be obtained in a terminal which uses a time divisionmultiple access (TDMA) scheme.

The multilayer electronic component 100, according to the firstexemplary embodiment, may receive a signal through the input terminal131 disposed on the lower surface of the body 110, remove noise from thereceived signal through the ground terminal 133, and output the signal,from which the noise has been removed, through the output terminal 132.

The input terminal 131, the output terminal 132, and the ground terminal133 may be disposed on the lower surface of the body 110 and be extendedto both side surfaces of the body 110.

In addition, referring to FIG. 1, the input terminal 131 and the outputterminal 132 may be disposed to coincide with both end surfaces of thebody 110. However, the input terminal 131 and the output terminal 132are not limited to being disposed as described above, and mayalternatively be disposed to be spaced apart from both end surfaces ofthe body 110 by a predetermined distance.

Furthermore, although not illustrated in FIG. 1, additional externalterminals may also be disposed on the upper surface of the body 110, inaddition to the input terminal 131, the output terminal 132, and theground terminal 133 disposed on the lower surface of the body 110.

According to the first exemplary embodiment, a mounted surface of themultilayer electronic component 100 may be the lower surface of the body110.

The input terminal 131, the output terminal 132, and the ground terminal133 may be formed of a conductive paste containing a conductive metal.

The conductive metal may be nickel (Ni), copper (Cu), tin (Sn), or analloy thereof, but is not limited thereto.

The conductive paste may further contain an insulating material. Theinsulating material may be, for example, glass, but is not limitedthereto.

A method of forming the input terminal 131, the output terminal 132, andthe ground terminal 133 is not particularly limited. That is, the inputterminal 131, the output terminal 132, and the ground terminal 133 maybe formed on the body 110 by a printing method, a dipping method, aplating method, or the like.

A plating layer may later be formed on the input terminal 131, theoutput terminal 132, and the ground terminal 133.

The multilayer electronic component 100 may be a three-terminal LCfilter having the input terminal 131, the output terminal 132, and theground terminal 133, but is not limited thereto.

Referring to FIG. 2, the multilayer electronic component 100 accordingto the first exemplary embodiment may include an inductor part Lincluding coil portions 141 a, 141 b, 141 c, and 141 d disposed in thebody 110 to be perpendicular to the lower surface of the body 110 and acapacitor part C including a plurality of internal electrodes 121 and122 disposed in the body 110 to be perpendicular to the lower surface ofthe body 110.

The inductor part may be manufactured by printing thick electrodes onthin ferrite or glass ceramic sheets, stacking several sheets on which acoil pattern is printed, and connecting internal conducting wires toeach other through vias.

That is, the inductor part may be formed by disposing the coil portions141 a, 141 b, 141 c, and 141 d on the one or more dielectric and/ormagnetic layers 111 and connecting the coil portions 141 a, 141 b, 141c, and 141 d to each other through vias 160.

The coil portions 141 a, 141 b, 141 c, and 141 d may be disposed in thebody 110 to be perpendicular to the lower surface of the body 110, butare not limited thereto.

According to the first exemplary embodiment, the inductor part may be aferrite bead capable of removing only a noise component without having alarge influence on a basic wave of a signal even in a case in whichfrequencies of the basic wave and the noise component of the signal areclose to each other.

Although the number of each coil portion 141 a, 141 b, 141 c, or 141 dillustrated in FIG. 2 is one to three, it is not particularly limited inan actual application.

In addition, the shape of a pattern composed of the coil portions 141 a,141 b, 141 c, and 141 d illustrated in FIG. 2 is only depicted by way ofexample, and may vary in order to adjust inductance.

The coil may include first to fourth coil portions 141 a, 141 b, 141 c,and 141 d. The first coil portion 141 a may be exposed to the lowersurface of the body 110 and be connected to the input terminal 131.

In addition, the fourth coil portion 141 d may be exposed to the lowersurface of the body 110 and be connected to the output terminal 132.

The capacitor part may be formed by including the plurality of internalelectrodes 121 and 122 formed on the one or more dielectric and/ormagnetic layers 111.

The internal electrodes 121 and 122 may be disposed in the body 110 tobe perpendicular to the lower surface of the body 110, but are notlimited thereto.

According to the first exemplary embodiment, the capacitor part Ctogether with the inductor part having the form of the ferrite bead mayform a single electronic component to serve as a filter which removesnoise components, and may, for example, be a low capacitance multilayerceramic capacitor in which there is a small overlapping area betweeninternal electrodes and coil portions facing each other with each of thedielectric or magnetic layers interposed therebetween.

FIG. 2 illustrates that two first internal electrodes 121 and two secondinternal electrodes 122 may form respective internal electrode units,but the number of internal electrodes in each unit is not particularlylimited in an actual application. That is, the number of internalelectrodes in each unit may be varied. In addition, the internalelectrodes 121 and 122 may have the same shape as illustrated in FIG. 2.Alternatively, the internal electrodes 121 and 122 may have differentshapes.

In addition, the shape of a pattern composed of the internal electrodes121 and 122 illustrated in FIG. 2 is only depicted by way of example,and may vary in order to adjust capacitance.

The internal electrodes 121 and 122 may be exposed to the lower surfaceof the body 110 and may be connected to the ground terminal 133.

According to the first exemplary embodiment, the capacitor part C may beformed by the internal electrodes 121 and 122 and the coil portions 141b facing each other.

In the multilayer electronic component 100, according to the firstexemplary embodiment, the capacitor part C may be formed by the internalelectrodes 121 and 122 and the coil portions 141 b facing each otherwith the one or more dielectric and/or magnetic layers 111 interposedtherebetween.

A level of capacitance of the capacitor part C may be determined by anarea of the multilayer electronic component 100 in which the internalelectrodes 121 and 122 and the coil portions 141 b overlap with eachother.

That is, the multilayer electronic component 100, according to the firstexemplary embodiment, may have a structure in which the ferrite bead andthe multilayer ceramic capacitor are coupled to each other, whereincapacitance may be formed between the second coil portions 141 b amongthe coil portions 141 a, 141 b, 141 c, and 141 d of the ferrite beadforming the inductor part facing the internal electrodes 121 and 122.

FIG. 3 is a plan view of the first and second internal electrodesillustrated in FIG. 2.

Referring to FIG. 3, the plurality of internal electrodes 121 and 122may have different widths.

That is, one internal electrode unit including the first internalelectrode 121 and another internal electrode unit including the secondinternal electrode 122 may be disposed in the body 110, and widths ofthe internal electrodes in the two internal electrode units may bedifferent from each other.

For example, when the width of the first internal electrode 121 is W1and the width of the second internal electrode 122 is W2, W1>W2 may besatisfied.

The width W1 of the first internal electrode 121 and the width W2 of thesecond internal electrode 122 may be adjusted to satisfy W1>W2, wherebybroadband attenuation characteristics of the multilayer electroniccomponent may be improved.

That is, according to the first exemplary embodiment, levels ofcapacitance may be varied depending on the positions of the coilportions of the ferrite bead forming the inductor part, whereby thebroadband attenuation characteristics of the multilayer electroniccomponent may be improved.

FIGS. 2 and 3 illustrate that the number of internal electrode unitshaving different widths is two, such that the number of capacitors C1and C2 having different levels of capacitance is two. However, thenumber of capacitors disposed in the body 110 and having differentlevels of capacitance is not limited thereto, and may be three or more(C1, C2, C3 . . . ).

In addition, FIGS. 2 and 3 illustrate that the levels of capacitance ofcapacitors are different from each other due to different widths of theinternal electrodes, but the present inventive concept is not limitedthereto. A plurality of capacitors having different levels ofcapacitance may be formed by adjusting overlapping areas due todifferent thicknesses of internal electrodes or due to different widthsand thicknesses of internal electrodes.

Meanwhile, according to the first exemplary embodiment, the plurality ofinternal electrodes 121 and 122 may have respective leads 121 a and 122a exposed to the lower surface of the body 110.

The plurality of internal electrodes 121 and 122 may be disposed in thebody 110 to be perpendicular to the lower surface of the body 110, andmay have the leads 121 a and 122 a exposed to the lower surface of thebody 110, so that equivalent series inductance (ESL) of the capacitorpart is reduced, whereby the broadband attenuation characteristics ofthe multilayer electronic component may be improved.

When the multilayer electronic component is mounted on a circuit boardto be perpendicular to the circuit board, current may directly flowbetween electrode pads of the board and the internal electrodes throughthe ground terminal without a separate current path, whereby the ESL ofthe capacitor part may be reduced.

In addition, in an EMI filter, ESL of a capacitor needs to be low inorder to improve broadband attenuation characteristics. According to thefirst exemplary embodiment, the multilayer electronic component has astructure in which the ESL of the capacitor part is reduced as describedabove, and the above-mentioned effect may be obtained.

According to the first exemplary embodiment, the plurality of internalelectrodes 121 and 122 and the coil portions 141 b may face each other,such that the inductor part and the capacitor part may be connected inparallel with each other.

That is, the multilayer electronic component 100 may have a structure inwhich the ferrite bead forming the inductor part and the multilayerceramic capacitor forming the capacitor part are coupled to each other.The capacitor part may be formed in some coil portions of the ferritebead, and the inductor part and the capacitor part may be connected inparallel with each other.

Therefore, even in a case in which the frequencies of the basic wave andthe noise component of the signal are close to each other, only thenoise component may be removed without having a large influence on thebasic wave. The capacitor part may have reduced ESL and include theplurality of capacitors having different levels of capacitance, wherebythe broadband attenuation characteristics may be improved.

FIG. 4 is an equivalent circuit diagram of the multilayer electroniccomponent illustrated in FIG. 1.

Referring to FIG. 4, the multilayer electronic component 100, accordingto the first exemplary embodiment, may receive a signal through theinput terminal 131 disposed on the lower surface of the body 110, removenoise from the received signal through the ground terminal 133, andoutput the signal, from which the noise has been removed, through theoutput terminal 132.

The noise may be removed by the inductor part L and the capacitor part Cincluded in the multilayer electronic component 100, and the removednoise may exit through the ground terminal 133.

In addition, the capacitor part may be formed in some coil portions ofthe ferrite bead configuring the inductor part, and the inductor partand the capacitor part may be connected in parallel with each other.

The capacitor part C may include two capacitors C1 and C2 havingdifferent levels of capacitance. However, the capacitor part C is notlimited to including the two capacitors C1 and C2, but may include threeor more capacitors having different levels of capacitance.

In addition, the capacitor part may be formed in some coil portions andbe connected in series with some coil portions, and there may be an ESLcomponent between the capacitor part and the ground terminal 133.

As described above, the multilayer electronic component, according tothe first exemplary embodiment, may include an inductor and a pluralityof capacitors having different levels of capacitance. Levels ofinductance of the inductor and capacitance of the plurality ofcapacitors may be individually controlled.

The multilayer electronic component having the above-mentionedstructure, according to the first exemplary embodiment, may have anexcellent noise-removal effect even in the case that the frequency bandsof the noise and the signal are close to each other, and may haveimproved broadband attenuation characteristics.

In addition, in a terminal using a TDMA scheme, attenuation and noise,which are major transmission faults, may occur during data transmission.However, the multilayer electronic component, according to the firstexemplary embodiment, may solve the above-mentioned problem by servingas a dedicated EMI filter having an excellent noise-reduction effect.

Meanwhile, a multilayer electronic component 100, according to a secondexemplary embodiment, may include: a body 110 including one or moreceramic and/or magnetic layers 111; an inductor part including first tofourth coil portions 141 a, 141 b, 141 c, and 141 d disposed in the body110 to be perpendicular to a lower surface of the body 110; a capacitorpart including first and second internal electrodes 121 and 122 disposedin the body 110 to be perpendicular to the lower surface of the body 110and having respective leads 121 a and 122 a exposed to the lowersurfaces of the body 110; and an input terminal 131, an output terminal132, and a ground terminal 133 disposed on the lower surface of the body110, wherein the capacitor part includes a first capacitor C1 formed bythe first internal electrode 121 and the second coil portion 141 bfacing each other and a second capacitor C2 formed by the secondinternal electrode 122 and the second coil portion 141 b facing eachother.

Widths of the first internal electrode 121 and the second internalelectrode 122 may be different from each other, and the plurality offirst and second internal electrodes may be provided.

According to the second exemplary embodiment, even in a case that thefrequency bands of noise and a signal are close to each other, excellentnoise removal may be obtained and broadband attenuation characteristicsmay be improved.

Since features of the multilayer electronic component according to thesecond exemplary embodiment other than the above-mentioned featuresthereof are the same as those of the multilayer electronic componentaccording to the first exemplary embodiment, a description thereof willbe omitted.

Meanwhile, a multilayer electronic component 100, according to a thirdexemplary embodiment, may include: a body 110 including one or moreceramic and/or magnetic layers 111; a ferrite bead part including coilportions 141 a, 141 b, 141 c, and 141 d disposed in the body 110 to beperpendicular to a lower surface of the body 110; a capacitor partincluding a plurality of internal electrodes 121 and 122 disposed in thebody 110 to be perpendicular to the lower surface of the body 110 andhaving respective leads 121 a and 122 a exposed to the lower surface ofthe body 110; and an input terminal 131, an output terminal 132, and aground terminal 133 disposed on the lower surface of the body 110,wherein the ferrite bead part and the capacitor part are connected inparallel with each other.

The plurality of internal electrodes 121 and 122 may form two or moreinternal electrode units having different widths, but are not limitedthereto. That is, a plurality of internal electrode units havingdifferent widths may be disposed in the body 110.

Since features of the multilayer electronic component according to thethird exemplary embodiment other than the above-mentioned featuresthereof are the same as those of the multilayer electronic componentaccording to the first exemplary embodiment, a description thereof willbe omitted.

Referring to FIG. 4, a multilayer electronic component, according to afourth exemplary embodiment, may include: a signal input part; anoise-removal part which removes noise from a signal input from thesignal input part; and a signal output part which outputs a signal fromwhich the noise has been removed, wherein the noise-removal partincludes a body 110 having an inductor part including coil portions 141a, 141 b, 141 c, and 141 d and a capacitor part including a plurality ofinternal electrodes 121 and 122, the capacitor part being formed by theplurality of internal electrodes 121 and 122 and the coil portions 141 bfacing each other.

The signal input part corresponds to the input terminal 131 of themultilayer electronic component, according to the first to thirdexemplary embodiments, and the signal output part corresponds to theoutput terminal 132 of the multilayer electronic component, according tothe first to third exemplary embodiments.

The coil portions 141 a, 141 b, 141 c, and 141 d may be disposed in thebody 110 to be perpendicular to the lower surface of the body 110, andthe plurality of internal electrodes 121 and 122 may be disposed in thebody 110 to be perpendicular to the lower surface of the body 110.

The plurality of internal electrodes 121 and 122 and the coil portions141 b may face each other, such that the inductor part and the capacitorpart may be connected in parallel with each other.

Since features of the multilayer electronic component according to thefourth exemplary embodiment other than the above-mentioned featuresthereof are the same as those of the multilayer electronic componentaccording to the first to third exemplary embodiments, a descriptionthereof will be omitted.

Board Having Multilayer Electronic Component

FIG. 5 is a perspective view of a board in which the multilayerelectronic component of FIG. 1 is mounted on a printed circuit board.

Referring to FIG. 5, a board 200 having a multilayer electroniccomponent 100, according to the present exemplary embodiment, mayinclude: a printed circuit board 210 on which the multilayer electroniccomponent 100 is mounted while the coil portions and the internalelectrodes thereof are perpendicular to the printed circuit board 210;and first to third electrode pads 221 to 223 disposed on the printedcircuit board 210 to be spaced apart from each other.

Here, the multilayer electronic component 100 may be electricallyconnected to the printed circuit board 210 by solders 230 in a state inwhich the input terminal 131, the output terminal 132, and the groundterminal 133 thereof are positioned to contact the first to thirdelectrode pads 221 to 223, respectively.

A description of features which overlap those of the multilayerelectronic component according to the first exemplary embodiment, exceptfor the above-mentioned description, will be omitted.

As set forth above, in a multilayer electronic component, according toexemplary embodiments, a ferrite bead and low capacitance multilayerceramic capacitors are combined to forma single electronic component,and levels of capacitance are changed according to the low capacitancemultilayer ceramic capacitors, whereby broadband attenuationcharacteristics may be improved.

In addition, when being mounted perpendicularly to a circuit board, thelow capacitance multilayer ceramic capacitors have reduced ESL, wherebyattenuation characteristics may be improved.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentinventive concept as defined by the appended claims.

What is claimed is:
 1. A multilayer electronic component comprising: abody including one or more ceramic layers or magnetic layers; aninductor part including coil portions disposed in the body to beperpendicular to a lower surface of the body; a plurality of internalelectrodes disposed in the body to be perpendicular to the lower surfaceof the body; and an input terminal, an output terminal, and a groundterminal disposed on the lower surface of the body, wherein the bodyincludes a capacitor part comprising at least one among the plurality ofinternal electrodes and at least one among the coil portions with atleast one of the ceramic layers or magnetic layers interposedtherebetween.
 2. The multilayer electronic component of claim 1, whereineach of the plurality of internal electrodes has a respective leadexposed to the lower surface of the body.
 3. The multilayer electroniccomponent of claim 1, wherein the plurality of internal electrodes format least two internal electrode units having different widths.
 4. Themultilayer electronic component of claim 1, wherein the inductor partand the capacitor part are connected to each other in parallel.
 5. Themultilayer electronic component of claim 1, wherein the coil portionsare connected to each other through vias.
 6. A multilayer electroniccomponent comprising: a body including one or more ceramic layers ormagnetic layers; an inductor part including first and second coilportions disposed in the body to be perpendicular to a lower surface ofthe body; a capacitor part including first and second internalelectrodes disposed in the body to be perpendicular to the lower surfaceof the body, the first and second internal electrodes each havingrespective leads exposed to the lower surface of the body; and an inputterminal, an output terminal, and a ground terminal disposed on thelower surface of the body, wherein the capacitor part includes a firstcapacitor comprising the first internal electrode and the second coilportion and a second capacitor comprising the second internal electrodeand the second coil portion.
 7. The multilayer electronic component ofclaim 6, wherein the first and second internal electrodes have differentwidths.
 8. The multilayer electronic component of claim 6, wherein theinductor part and the capacitor part are connected to each other inparallel.
 9. The multilayer electronic component of claim 6, wherein thefirst and second coil portions are connected to each other through vias.